Original language | English |
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Article number | 03009 |
Journal | MATEC Web of Conferences |
Volume | 51 |
DOIs | |
Publication status | Published (VoR) - 6 Apr 2016 |
Event | International Conference on Mechanical, Manufacturing, Modeling and Mechatronics, IC4M 2016 - Kuala Lumpur, Malaysia Duration: 27 Feb 2016 → 29 Feb 2016 |
Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for power QFN application
Gunaseelan Chandrakasan, Mark Ovinis
Research output: Contribution to journal › Conference article › peer-review