Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for power QFN application

Gunaseelan Chandrakasan, Mark Ovinis

    Research output: Contribution to journalConference articlepeer-review

    Original languageEnglish
    Article number03009
    JournalMATEC Web of Conferences
    Volume51
    DOIs
    Publication statusPublished (VoR) - 6 Apr 2016
    EventInternational Conference on Mechanical, Manufacturing, Modeling and Mechatronics, IC4M 2016 - Kuala Lumpur, Malaysia
    Duration: 27 Feb 201629 Feb 2016

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