Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for high power led packaging

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Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	14332-14337
Number of pages	6
Journal	ARPN Journal of Engineering and Applied Sciences
Volume	11
Issue number	24
Publication status	Published (VoR) - 2016

Keywords

@article{4d112859b4f8409ab743413647ed81f7,

title = "Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for high power led packaging",

keywords = "Die-attach, LED, Sinterable",

author = "Gunaseelan Chandrakasan and Mark Ovinis",

year = "2016",

language = "English",

volume = "11",

pages = "14332--14337",

journal = "ARPN Journal of Engineering and Applied Sciences",

issn = "1819-6608",

number = "24",

}

TY - JOUR

T1 - Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for high power led packaging

AU - Chandrakasan, Gunaseelan

AU - Ovinis, Mark

PY - 2016

Y1 - 2016

KW - Die-attach

KW - LED

KW - Sinterable

UR - https://www.scopus.com/pages/publications/85009186301

UR - https://www.scopus.com/pages/publications/85009186301#tab=citedBy

M3 - Article

AN - SCOPUS:85009186301

SN - 1819-6608

VL - 11

SP - 14332

EP - 14337

JO - ARPN Journal of Engineering and Applied Sciences

JF - ARPN Journal of Engineering and Applied Sciences

IS - 24

ER -