Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications

Andrew J. Pickwell, Robert A. Dorey, David Mba

    Research output: Contribution to journalArticlepeer-review

    Original languageEnglish
    Article number2043
    Pages (from-to)1994-2000
    Number of pages7
    JournalIEEE Trans Plasma Sci
    Volume36
    Issue number5
    DOIs
    Publication statusPublished (VoR) - 2008

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