Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications

Andrew J. Pickwell; Robert A. Dorey; David Mba

doi:10.1109/TUFFO.2011.2043

Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications

Andrew J. Pickwell, Robert A. Dorey, David Mba

Cranfield University

Research output: Contribution to journal › Article › peer-review

Original language	English
Article number	2043
Pages (from-to)	1994-2000
Number of pages	7
Journal	IEEE Trans Plasma Sci
Volume	36
Issue number	5
DOIs	https://doi.org/10.1109/TUFFO.2011.2043
Publication status	Published (VoR) - 2008

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@article{5e410150d6554f9a83ad0f9be2d3134c,

title = "Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications",

author = "Pickwell, \{Andrew J.\} and Dorey, \{Robert A.\} and David Mba",

note = "Publisher Copyright: {\textcopyright} 2011 IEEE.",

year = "2008",

doi = "10.1109/TUFFO.2011.2043",

language = "English",

volume = "36",

pages = "1994--2000",

journal = "IEEE Trans Plasma Sci",

issn = "0093-3813",

publisher = "Institute of Electrical and Electronics Engineers",

number = "5",

}

TY - JOUR

T1 - Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications

AU - Pickwell, Andrew J.

AU - Dorey, Robert A.

AU - Mba, David

PY - 2008

Y1 - 2008

UR - https://www.scopus.com/pages/publications/84994517941

UR - https://www.scopus.com/inward/citedby.url?scp=84994517941&partnerID=8YFLogxK

U2 - 10.1109/TUFFO.2011.2043

DO - 10.1109/TUFFO.2011.2043

M3 - Article

AN - SCOPUS:84994517941

SN - 0093-3813

VL - 36

SP - 1994

EP - 2000

JO - IEEE Trans Plasma Sci

JF - IEEE Trans Plasma Sci

IS - 5

M1 - 2043

ER -

Thick-film Acoustic emission sensors for use in structurally integrated condition-monitoring applications

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