Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

Andrew J. Pickwell; Robert A. Dorey; David Mba

doi:10.1109/TUFFC.2011.2043

Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

Andrew J. Pickwell
, Robert A. Dorey
, David Mba

Cranfield University

Research output: Contribution to journal › Article › peer-review

7 Citations (SciVal)

Original language	English
Pages (from-to)	1994-2000
Number of pages	7
Journal	IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Volume	58
Issue number	9
DOIs	https://doi.org/10.1109/TUFFC.2011.2043
Publication status	Published (VoR) - Sept 2011

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title = "Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications",

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AU - Dorey, Robert A.

AU - Mba, David

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SN - 0885-3010

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Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

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